Solid State Technology
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3. Your principal job function: (select only one)
General/Corporate Management Research & Development
Wafer-Fab Processing, Production Engineering Support
Process Development Plant/Facilities/Maintenance Engineering
Packaging Assembly Purchasing
Production Equipment Manufacturing Manufacturing or Engineering Management
Reliability, Quality Control, Evaluation, Testing Other (please specify)
Design


4. Your company or organization: (select only one)
Merchant/Captive Manufacturers
Foundries
Consortiums
R&D and Manufacturing of Semiconductors, ICs, Hybrid Circuits, Custom ICs, Semicustom ICs or ASICs
Semiconductor Manufacturing Equipment/Test Equipment
Basic Semiconductor Chemicals, Gases or Materials Manufacturers
IC Packaging or Semiconductor Packaging
Independent Research & Development Lab (not associated with a manufacturer)
Government and Military
Educational Institutions
Non-Semiconductor Products Manufacturing using Thin Film Technologies
Other Allied to the Field (please specify)


5. As part of my responsibilities: (select all that apply)
I manage or supervise a department or larger organization
I manage or supervise a project team
I manage or supervise one or more projects
Other management or supervisory responsibility
None of the above


6. I authorize, influence, specify or buy the following products: (select all that apply)
A. Chemicals & Materials H. Test/Metrology/Inspection
Chemicals Defect Inspection/Failure Analysis
Chemical Delivery In-situ and in-line Monitoring
Thin Film Materials Measurement Systems: Film Thickness, Flatness, Contamination, Stress
Wafers/Substrates Microscopes: optical
Packaging Material Microscopes: non-optical
B. Gases/Gas Handling Patterned Wafer Inspection/CD Measurement
Gases Testers (parametric and functional)/Probes
Gas Filters/Cabinets/Panels I. Contamination Control
Mass Flow Controllers Contamination Control Products
C. Lithography Static/Vibration Control Equipment
Photomasks/Mask Aligners J. Vacuum Equipment
Mask/Reticle Manufacturing Equipment Pumps
Photoresist Processing Tools: Coat, Develop, Bake, Strip Residual Gas Analyzers
Photoresists Vacuum Components (bellows, chambers, gauges, valves, etc)
Positioning Equipment K. Automation/Wafer Handling
Wafer Steppers & Scanners Intrabay/Interbay Automation
D. Thermal Processing/Implant Robotics
Thermal: Annealing, RTP, Laser, E-Beam Wafer cassettes, boats
Furnaces/Diffusion/Oxidation Equipment Diagnostics software
Ion Implanters Fab automation software
E. Deposition Yield management software
Chemical Vapor Deposition Equipment Machine Vision
Sputtering (PVD)/Electroplating Systems L. Allied Technologies
F. Etching/Planarization Compound Semiconductors
CMP Equipment MEMS
Plasma Etch Nanotechnology
Wet Chemical Processing FPDs
G. Packaging/Assembly Photovoltaics
Bonding: Wire, Die, TAB
Dicing, Scribing and Die Separation
Packaging, Encapsulating, Sealing
Flipchip/BGA Process Equipment
None of the products listed in sections A thru L above.


7. Please indicate the number of employees at your company. (select only one)
1,000 or more 100 to 249
500 to 999 50 to 99
250 to 499 1 to 49


8. What other publications do you receive? (select all that apply)
Advanced Packaging EuroAsia Semiconductor
Chip Scale Review Small Times
Compound Semiconductor Semiconductor International
EE Times


9. In the performance of my job, I BUY, SPECIFY, and/or INFLUENCE the PURCHASE of products and/or services in the following regions: (select all that apply)
China North America
Europe (West) South America
Europe (East, including Russia) Southeast Asia
India Rest of World
Japan None of the above


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Copyright © 2008 Solid State Technology, All Rights Reserved.